INFOLAB LTD

SPIE Photonics West 2024

SPIE Photonics West 2024
January 28 - February 2, 2024
Moscone Center - South Hall | San Francisco, CA

Come visit us at booth 1858

January 27 |  Moscone Center – South Hall | San Francisco, CA

We are excited to return to San Francisco, CA for this year’s  SPIE Photonics West  Annual Conference and Exhibition. Visit us at the Moscone Center in Booth# 1858 to learn about our broad range of 2D and 3D surface profiler solutions for R&D, QA/QC, and failure analysis research. We’ll be highlighting how white light interferometry is more valuable than ever in materials R&D for optics, due to the latest advances in non-contact 3D optical metrology. Our team of experts will be available to answer any questions you may have and discuss how the latest technology can advance your research.

Highlights:

  • View our broad range of 2D and 3D surface profiler solutions to supply the specific information needed to answer R&D, QA/QC, and failure analysis questions with quantifiable accuracy and speed.
  • Learn about Bruker’s latest 3D optical microscopes to measure surface roughness, texture, corrosion, wear, volume loss, and other s-parameters with industry-leading ease of use.

 

 

Conference Host:
The International Society for Optics and Photonics

Conference Venue:
Moscone Center – South Hall | San Francisco, CA

To find out more about this event, the products and technology featured in it, or any of our other solutions for Optical Profilometry:

Featured Products and Technology

3D Optical Profilers

3D Optical Profilers

Non-contact 3D surface measurement, inspection, and analysis
ContourX-500 3D Optical Profilometer

ContourX-500

Full-featured optical profilometer with advanced automation and proprietary tip/tilt metrology head
ContourX-200 3D Optical Profilometer

ContourX-200

Flexible optical profilometer with X/Y/Z automation, stitching, and advanced find surface
Electronic-circuit-board-futuristic-server-code-teaser-STOCK

White Light Interferometry

Advanced WLI profilers provide robust metrology-based inspection for advanced packaging applications